2013年7月17日星期三

What’s the core technology and difficulties of the LED light

Since the external lighting was generated, the lighting is divided into three age: filament bulb (incandescent) Age, the gas lamp era (fluorescent), the semiconductor light-emitting era (LED). the most important investigation point is the incandescent which has the longest history and the LED that will be the mainstream in future. Regardless of how the development of the times, the lighting industry’s production processes are surprisingly similar.
1, the principle of LED light-emitting is that the electrons pass through a layer of semiconductor material to stimulate that the semiconductor material converts electrical energy into light energy. However, the single semiconductor light-emitting layer is weak, so many single layer is added together to pressed into composite material that is similar to Lapis kind, which is the “wafer.”
Therefore, LED luminous efficiency depends on how mangy layers can be pressed into in the same thickness. The thinner the layer material is, the more the layers can be superimposed, the higher the luminous efficiency is. The thickness of each layer is now generally only 2-20 microns, which also determines producing the LED epitaxial wafer is the most difficult part of the entire production process.
2, the cutting – LED Core: equivalent to take filament from the tungsten , the difference is that the wafer is a block shape after being cut,.
Because the epitaxial wafers have special structure, it is very difficult to cut the light-intact core,. Not only requires a vacuum environment, but also a professional cutting machine. Currently only two manufacturers produce the cutting machine.
3, put the core into the LED chip: the chip for LED, as the lamp holder for the bulb,which is the powered parts. “Chip” is very important equipment for LED to achieve the desired effect, because the LED very high demand on the current.
4, packaged LED chips into a luminous body: the LED chip is packaged as light as the shade is added outside the filament and lamp holder to made of the bulbs. Shade that can be based on the desired shape is different, but the packaging technology determines the life of light.
5, lighting applications: is the same as the use of incandescent bulbs, LED products are assembled ,depending on the different functions and needs.
For LED lighting, the three steps of epitaxial wafers, cut and chip is the upstream, fourth step of the package is midstream, the fifth step of the application is downstream. These issues we need to use more energy to break.
Shenzhen Lead Opto-Technology Co. Ltd is a professional manufacturer of  LED lighting, mainly produce  LED High Bay Light, LED Flood Light, LED Panel,LED Ceiling Light etc with OEM&ODM service. As an ISO 9001:2000-certified factory, we can meet the strict standards of CE, RoHS, FCC certificate, these strict producing standards guarantee our products distribute smoothly both in domestic and international markets.Browse http://www.lead-lighting.com for more information about the LED light.

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